Carbon-Based Direct Plating Process

ABSTRACT

A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

FIELD OF THE INVENTION

The present invention relates generally to a carbon-based direct platingprocess for printed circuit board manufacture.

BACKGROUND OF THE INVENTION

Printed wiring boards (also known as printed circuit boards or PWB's)are generally laminated materials comprising two or more plates of foilsof copper, which are separated from each other by a layer ofnon-conducting material. Although copper is generally used as theelectroplating metal in printed wiring boards, other metals such asnickel, gold, palladium, silver and the like can also be electroplated.The non-conducting layer(s) preferably comprise an organic material suchas an epoxy resin impregnated with glass fibers, but may also comprisethermosetting resins, thermoplastic resin, and mixtures thereof, aloneor in combination with reinforcing materials such as fiberglass andfillers.

In many printed wiring board designs, the electrical pathway or patternrequires a connection between the separated copper plates at certainpoints in the pattern. This is usually accomplished by drilling holes atthe desired locations through the laminate of copper plates and thenon-conducting layer(s) and connecting the separate metal plates.Subsequently, the through-hole walls of the printed wiring board areprepared for electroplating. These plated through-hole walls arenecessary to achieve connections between two metal circuit patterns oneach side of a printed wiring board, and/or between the inner layercircuit patterns of a multilayer board.

While electroplating is a desirable method of depositing copper andother conductive metals on a surface, electroplating cannot be used tocoat a nonconductive surface, such as an untreated through hole. It istherefore necessary to treat the through hole with a conductive materialto make it amenable to electroplating.

One process for making the through-hole bores electrically conductiveinvolves physically coating them with a conductive film. The coatedthrough-holes are conductive enough to electroplate, but typically arenot conductive and sturdy enough to form the permanent electricalconnection between the circuit layers at either end of the through-hole.The coated through-holes are then electroplated to provide a permanentconnection. Electroplating lowers the resistance of the through-holebore to a negligible level, which will not consume an appreciable amountof power or alter circuit characteristics.

One method of preparing through-hole walls for electroplating is acarbon-based process that utilizes a liquid carbon dispersion. Thetypical steps of this process are as follows:

1) Surfaces of the through-holes are drilled and deburred. In the caseof multilayer printed circuit boards, the boards may also be subjectedto a Besmear or etchback operation to clean the inner copper interfacingsurfaces of the through holes;

2) The printed wiring board is preferably subjected to a precleaningprocess to prepare the printed wiring board to receive the liquid carbonblack dispersion thereon;

3) After the application of the cleaner, the PWB is rinsed in water toremove excess cleaner from the board and then contacted with aconditioner solution. The conditioner solution ensures thatsubstantially all of the hole wall surfaces are prepared to accept acontinuous layer of the subsequently applied carbon-based dispersion;

4) The liquid carbon-based dispersion is applied to or contacted withthe conditioned PWB. The liquid carbon dispersion contains threecritical ingredients, namely, carbon black, one or more surfactantscapable of dispersing the carbon, and a liquid dispersing medium such aswater. The preferred methods of applying the dispersion to the PCBinclude immersion, spraying or other methods of applying chemicals thatare typically used in the printed circuit board industry. A singleworking bath is generally sufficient for applying the carbon dispersion;however, more than one bath may be used for rework or other purposes;and

5) The carbon-covered printed wiring board is subjected to a stepwherein substantially all (i.e., more than about 95% by weight) of thewater in the applied dispersion is removed and a dried depositcontaining carbon is left in the holes and on other exposed surfaces ofthe nonconducting layer. This drying step may be accomplished by variousmethods, including, for example, evaporation at room temperature,heating the PWB for a period of time at an elevated temperature, an airknife, or other similar means generally known to those skilled in theart. To insure complete coverage of the hole walls, the procedure ofimmersing the board in the liquid carbon dispersion and then drying maybe repeated.

Thereafter, the metal portions of the substrate are aggressively etchedwith high spray pressures and high total etch amounts to sufficientlyremove the dried carbon coating from the metal portions of thesubstrate.

The microetch procedure performs two very desirable tasks at once: (1)the microetch step removes substantially all excess carbon black orgraphite material adhering to the outer copper plates or foils and theexposed surfaces of copper inner plates or foils in a multilayer PWB;and (2) the microetch step chemically cleans and microetches slightlythe outer copper surfaces, thereby making them good bases for either dryfilm application or the electrolytic deposition of copper when followedby mechanically scrubbing of the PWB.

The mechanism by which this microetch step works is not by attacking thecarbon black material or the graphite material deposited on the copperfoil directly, but rather by attacking exclusively the first few atomiclayers of copper directly below which provides the adhesion for thecoating. The fully coated board is then immersed in the microetchsolution to “flake” off the carbon black or graphite from the coppersurfaces in the form of micro-flakelets. These micro-flakelets may thenbe removed from the microetch bath either by filtration through a pumpor via a weir type filter arrangement commonly used in the PWB industry.

The liquid carbon black dispersion or graphite dispersion, the microetchtreatment, and the intermittent water rinses are preferably carried outby immersing the PWB in baths constructed of polypropylene or polyvinylchloride (PVC) and kept agitated by a recirculation pump or pumped inair or by a conveyorized flood or spray machine. The carbon black orgraphite coated PWB is immersed in or otherwise contacted with themicroetch solution to “flake” off the carbon black or graphite from thecopper surfaces which are then removed from the microetch bath byfiltering or other similar means.

The steps of this process are described in more detail, for example, inU.S. Pat. No. 4,619,741, the subject matter of which is hereinincorporated by reference in its entirety. Various modifications andrefinements to this process are set forth in U.S. Pat. Nos. 4,622,107,4,622,108, 4,631,117, 4,684,560, 4,718,993, 4,724,005, 4,874,477,4,897,164, 4,964,959, 4,994,153, 5,015,339, 5,106,537, 5,110,355,5,139,642, 5,143,592, and 7,128,820, the subject matter of each of whichis herein incorporated by reference in its entirety.

U.S. Pat. No. 4,897,164 to Piano et al. describes a process in whichafter the drying step, the dried deposit of carbon black in thethrough-holes is contacted with an aqueous solution of an alkali metalborate prior to microetching to remove loose or easily removable carbonblack particles from the areas of the through-holes.

U.S. Pat. No. 4,964,959 to Piano et al. describes the addition of aconductive polymer or combinations thereof to the carbon backdispersion.

U.S. Pat. No. 4,994,153 to Piano et al, describes a process for treatingthe tooling holes or slots which have been coated with a carbon blackdispersion in a nonconductive material which comprises removing saidcarbon black with an aqueous solution containing: (a) an alkanolamine;(b) an anionic surfactant which is the neutralized addition product ofmaleic and/or fumaric acid and a poly(oxylated) alcohol; (c) a nonionicsurfactant which is an aliphatic mono and/or diphosphate ester; and (d)an alkali or alkaline earth metal hydroxide.

U.S. Pat. No. 5,015,339 to Pendleton describes an electroplatingpretreatment wherein nonconductive material is first contacted with analkaline permanganate solution, then a neutralizer/conditioner solutionand then a carbon black dispersion.

All of the processes described in these references contain a step inwhich the carbon-covered printed wiring board is subjected to a stepwherein substantially all (i.e., more than about 95% by weight) of thewater in the applied dispersion is removed and a dried depositcontaining carbon is left in the holes and on other exposed surfaces ofthe nonconducting layer prior to the microetching step.

In a variation on this basic process, the carbon-coated wiring board maybe subjected to a fixing step prior to drying in order to remove excesscarbon dispersion from the surface of the printed wiring board and tomake the carbon dispersion more workable as described, for example, inU.S. Pat. Pub. No. 2010/0034965 to Retallick et al., the subject matterof which is herein incorporated by reference in its entirety. Fixing maybe accomplished by a chemical fixing method or by a mechanical fixingmethod.

In chemical fixing, a fixing solution is applied to the surfaces thathave been wetted with the carbon dispersion and the fixing solutionremoves excess carbon composition deposits, smoothing the carbon coatingon the recess surfaces by eliminating lumps and making the coating moreuniform. In physical fixing, the recesses or other surfaces of thesubstrate which have been wetted with the carbon dispersion aresubjected to a mechanical force to remove excess deposits of the carboncoating before it is dried. For example, a fluid jet may be used tocontact the surfaces that have been coated with the carbon dispersion.The jet blows away any excess accumulation of the carbon deposit andsmooths the carbon coating on the recess surfaces by elimination lumpsand making the coating more uniform. Another fixing means involves theuse of an air jet in the form of an air knife.

Once the carbon-coated printed wiring board has been microetched, theprinted wiring board can be electroplated with a suitable conductivemetal.

The microetch frequently causes problems, particularly in plating in thearea of the copper dielectric interface. In particular, etching thecopper frequently also strips the carbon coating from the dielectricarea directly adjacent to the copper, thereby creating an insulatingbarrier for electrical continuity in the subsequent electroplating step.This barrier may then lead to poor plating and defects such as voids,knit lines, and plating folds. To avoid such kinds of defects, a lowermicroetch step is desirable.

To adequately remove the carbon black or graphite from the coppersurfaces, large pumps, high pressures, large etch chambers, and/oraggressive etching chemistry must be employed to produce an acceptableresult. In addition, it is also necessary that the equipment be cleanedoften to reduce nodulation in the metal plating step for the carbonblack or graphite that has been flaked off the copper surfaces.

Thus, it would be desirable to provide a direct plating process thatoffers reduced nodulation and that also does not require additionalprocessing steps or conditions to produce a good result.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an improved directplating process for preparing a PWB to accept electroplating thereon.

It is another object of the present invention to provide an improveddirect plating process that offers reduced nodulation.

It is still another object of the present invention to provide a directplating process that improves electroplating conditions.

To that end, in one embodiment the present invention relates generallyto a method of preparing a non-conductive substrate to allow metalplating thereon, the method comprising the steps of:

a) conditioning the non-conductive substrate with a conditioning agent;

b) applying a liquid carbon-based dispersion to the conditionednon-conductive substrate to form a carbon coating on the conditionednon-conductive substrate, wherein the carbon-based dispersion comprisescarbon or graphite particles dispersed in a liquid solution; and

c) etching the substrate,

wherein the etching step is performed before the liquid carbon-baseddispersion dries on the non-conductive substrate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention relates generally to a carbon-based direct platingprocess for printed circuit board or printed wiring board manufacture.

As used herein, “a,” “an,” and “the” refer to both singular and pluralreferents unless the context clearly dictates otherwise.

As used herein, the term “about” refers to a measurable value such as aparameter, an amount, a temporal duration, and the like and is meant toinclude variations of +/−15% or less, preferably variations of +/−10% orless, more preferably variations of +/−5% or less, even more preferablyvariations of +/−1% or less, and still more preferably variations of+/−0.1% or less of and from the particularly recited value, in so far assuch variations are appropriate to perform in the invention describedherein. Furthermore, it is also to be understood that the value to whichthe modifier “about” refers is itself specifically disclosed herein.

As used herein, spatially relative terms, such as “beneath”, “below”,“lower”, “above”, “upper”, “front”, “back”, and the like, are used forease of description to describe one element or feature's relationship toanother element(s) or feature(s). It is further understood that theterms “front” and “back” are not intended to be limiting and areintended to be interchangeable where appropriate.

As used herein, the terms “comprises” and/or “comprising,” specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

In one embodiment, the present invention relates generally to a methodof preparing a non-conductive substrate to allow metal plating thereon,the method comprising the steps of:

a) conditioning the non-conductive substrate with a conditioning agent;

b) applying a liquid carbon-based dispersion to the conditionednon-conductive substrate to form a carbon coating on the conditionednon-conductive substrate, wherein the carbon-based dispersion comprisescarbon or graphite particles dispersed in a liquid solution; and

c) etching the substrate,

wherein the etching step is performed before the liquid carbon-baseddispersion dries on the non-conductive substrate.

In one embodiment, the non-conductive substrate is a printed wiringboard substrate.

Once the etching step is performed, the non-conductive substrate andcarbon dispersion can be dried to form a conductive coating on the PWBsubstrate and the PWB substrate can be plated with an electrodepositedmetal.

Surprisingly it has been discovered that an improved result can beobtained if the etching step is performed before the carbon-basedcoating dries on the substrate. Previously, as discussed above, it wasbelieved that it was necessary to first dry the carbon-based coatingonto the surface prior to contacting the substrate with the etchingsolution. Thus, it had previously been understood that drying of thecarbon-based dispersion on the surface was necessary prior to etchingthe substrate to allow the carbon particles to adhere to thenon-conductive portions of the substrate sufficiently to facilitateelectroplating of metal onto the non-conductive portions of thesubstrate.

In contrast, in the present invention, the etching step is performedprior to the drying step and without first drying the carbon suspensionsolution onto the surface. In other words, the drying step is notperformed until after the etching step has been completed.

The benefits of the process described herein include the following:

1) It is much easier to etch metal portions of the substrate if theetching step is performed prior to drying of the carbon coating. Whilethe dried carbon coating layer acts as a barrier to etching theunderlying metal, the wet carbon coating layer does not significantlyact as a barrier to etching;

2) The total etch amount and spray pressure needed to obtain clean metalportions of the substrate are greatly reduced if the substrate is etchedbefore the carbon coating is dried as compared with after the carboncoating is dried; and

3) The cleanliness of the process and the equipment used to apply thecarbon coating is greatly improved because carbon particles are etchedoff the metal portions of the substrate in the chamber or tankimmediately after the chamber or tank containing the carbonsuspension/colloid. Normally, this means that the outer surface of thesubstrate is completely free of carbon such that the rollers and driersnormally employed after the carbon suspension solution remain at leastsubstantially free of carbon particles.

Previously, the dried carbon coating was dried before etching and thedrying chamber and the rollers of the equipment changer becomecontaminated with the carbon particles. In contrast, in the presentinvention, the driers and rollers of the equipment remain clean and freeof carbon particles.

Collectively, the benefits of the process described herein also reducethe amount of nodulation that occurs in the metal plating step.Previously, the prior art process allowed for more carbon particles toremain on the metal portions of the substrate because of the difficultyin removing the particles in the etch step and due to carboncontamination from the dried carbon remaining on the equipment that canbe redeposited onto the surface of the substrate.

In the present invention, there is much reduced nodulation in the metalplating step because the wet carbon suspension that coats the substrateis etched off of the metal portions of the substrate before drying thecoating such that the carbon is removed from the metal portions of thesubstrate more completely. Thus, there is less opportunity for theequipment to redeposit dried carbon particles back onto the surface.This results in greatly reduced nodule formulation in the metal platingstep.

In the process described herein, the PWB may be subjected to aprecleaning step in which the PWB is prepared in order to place the PWBin condition for receiving the liquid carbon-based dispersion.

Next, the PWB is subjected to the conditioning step in which thesubstrate is contacted with a conditioner. In one embodiment, the PWB iscontacted with the conditioner by immersing the PWB in the conditioner.

The conditioner contains a conditioning agent having a high molecularweight. In one embodiment, the molecular weight of the conditioningagent is greater than about 100,000 g/mol, more preferably greater thanabout 500,000 g/mol, and even more preferably greater than about1,000,000 g/mol. The large molecular weight of the conditioning agentresults in the conditioner being in the form of a gel, which allows thecarbon particles to cling more closely to the through-hole walls and towithstand the spray etch step, even before the coating is dried.

The PWB substrate is contacted with the conditioner for at least 20seconds. In one embodiment, the PWB substrate may be contacted with theconditioner for between about 20 seconds to about 5 minutes. Inaddition, the pH of the conditioner is not critical and generally any pHis suitable. In one embodiment, the conditioner is generally alkalineand pH of about 9 is suitable. However, other pH values between 1 and14, more preferably between 7 and 14, more preferably between about 8and about 10 can also be used in the practice of the invention.

The temperature of the conditioner is also not critical and may be aboveabout room temperature or between room temperature and about 150° F.,more preferably between about 80 and about 130° F., more preferablybetween about 85 and about 110° F., or about 95° F.

Thereafter, the PWB is contacted with the carbon-based dispersion.

In one embodiment, the carbon deposition process involves theapplication of a liquid carbon dispersion to the cleaned and conditionedPWB. The carbon-based dispersion contains three principal ingredients,namely carbon, one or more surfactants capable of dispersing the carbon,and a liquid dispersing medium such as water. The preferred methods ofapplying the dispersion to the PCB include immersion, spraying or othermethods of applying chemicals used in the printed circuit boardindustry. A single working bath is sufficient for applying this carbonblack dispersion. However, more than one bath may be used for rework orother purposes.

In preparing the liquid carbon dispersion, the three primaryingredients, and any other preferred ingredients, are mixed together toform a stable dispersion. This may be accomplished by subjecting aconcentrated form of the dispersion to ball milling, colloidal milling,high-shear milling, ultrasonic techniques or other like procedures tothoroughly mix the ingredients. The dispersion can then be later dilutedwith more water to the desired concentration for the working bath.

One preferred method of mixing is ball milling a concentrated form ofthe dispersion in a container having glass mineral or plastic beadstherein for at least about 1 hour, and mixing can continue for up toabout 24 hours. This thorough mixing allows the carbon particles to beintimately coated or wetted with the surfactant. The mixed concentrateis then mixed with water or another liquid dispersing medium to thedesired concentration. In one preferred embodiment, the working bath iskept agitated during both the diluting and applying steps to maintaindispersion stability.

In addition, the carbon dispersion must also exhibit desirable traits,including a binder material that will allow the carbon particles tocoagulate onto the conditioned wall surface and form a gel-likecarbon/conditioner coating.

In one embodiment, the particle diameter of the carbon particlesaverages no more than about 3 microns while in the dispersion. It isdesirable to have an average particle diameter of carbon as small aspossible to obtain desired plating characteristics, includingsubstantially even plating and no plating pullaways. The averageparticle diameter of the carbon particles is preferably between about0.05 microns to about 3.0 microns, more preferably between about 0.08microns and about 1.0 microns when in the dispersion. As used herein,the term “average particle diameter” refers to the average mean diameterof the particles (the average by number). The average mean diameter inthe dispersion may be determined through the use of either a NiCompModel 370 submicron particle sizer (Version 3.0) or a HIAC PA-720automatic particle size analyzer (both available from the HIAC/ROYCOInstrument Division of Pacific Scientific of Menlo Park, Calif.). It isalso important to maintain the size distribution of the carbon particlesto a relatively narrow distribution.

Many types of carbon can be used, including, for example, commonlyavailable carbon blacks, furnace blacks, and suitable small particlegraphite. However, it is preferred to utilize carbon blacks which areinitially acidic or neutral, i.e. those which have a pH of between about1 and about 7.5, more preferably between about 2 and about 4 whenslurried with water. Preferred carbon black particles are also veryporous and generally have as their surface area from about 45 to about1100, and preferably about 300 to about 600, square meters per gram, asmeasured by the BET method (method of Brunauer-Emmert-Teller).

Examples of some commercially available carbon blacks suitable for usein the present invention include Cabot XC-72R Conductive, Cabot Monarch800, Cabot Monarch 1300 (all available from Cabot Corporation of Boston,Mass.). Other suitable carbon blacks include Columbian T-10189,Columbian Conductiex 975 Conductive, Columbian CC-40,220, and ColumbianRaven 3500 (all available from Columbian Carbon Company of New York,N.Y.). Suitable graphites include Showa-Denko UFG (available fromShowa-Denko K.K., 13-9 Shiba Daimon 1-Chrome, Minato-Ku, Tokyo, 105Japan), Nippon Graphite AUP (available from Nippon Graphite Industries,Ishiyama, Japan), and Asbury Micro 850 (available from Asbury GraphiteMills of Asbury, N.J.).

In addition to water and carbon, a surfactant capable of dispersing thecarbon in the liquid dispersing medium is employed in the dispersion.One or more surfactants are added to the dispersion to enhance wettingability and stability of the carbon and to permit maximum penetration bythe carbon within the pores and fibers of the non-conducting layer ofthe PCB. Suitable surfactants include anionic, nonionic and cationicsurfactants (or combinations thereof such as amphoteric surfactants).The surfactant should be soluble, stable and preferably non-foaming inthe liquid carbon dispersion. In general, for a polar continuous phaseas in water, the surfactant should preferably have a high HLB number(8-18).

The preferred type of surfactant will depend mainly on the pH of thedispersion. In one preferred embodiment, the total dispersion isalkaline (i.e. has an overall pH in the basic range). In this case, itis preferred to employ an anionic or nonionic surfactant.

Examples of acceptable anionic surfactants include sodium or potassiumsalts of naphthalene sulfonic acid such as DARVAN No. 1 (commerciallyavailable from Eastern Color and Chemical), PETRO AA and PETRO ULE(commercially available from Petro Chemical Co., Inc.), and AEROSOL OT(commercially available from American Cyanamid). Preferred anionicsurfactants include neutralized phosphate ester-type surfactants such asMAPHOS 55,56,8135, 60A and L6 (commercially available from BASF ChemicalCo.). Examples of suitable nonionic surfactants include ethoxylatednonyl phenols such as the POLY-TERGENT B-series (commercially availablefrom Olin Corporation) or alkoxylated linear alcohol's such as thePOLY-TERGENT SL-series (also commercially available from OlinCorporation).

Advantageously, carbon is present in the dispersion in an amount of lessthan about 15% by weight of the dispersion, preferably less than about5% by weight, most preferably less than 2% by weight, particularly whenthe form of carbon is carbon black. It has been found that the use ofhigher concentrations of carbon blacks may provide undesirable platingcharacteristics. In the same regard, the solids content (i.e. all of theingredients other than the liquid dispersing medium) is preferably lessthan about 10% by weight of the dispersion, more preferably, less thanabout 6% by weight.

The liquid carbon dispersion is typically placed in a vessel and theprinted circuit board is immersed in, sprayed with or otherwisecontacted with the liquid carbon dispersion. The temperature of theliquid dispersion in an immersion bath should be maintained at betweenabout 60° F. and about 95° F. and preferably between about 70° F. andabout 80° F. during immersion. The period of immersion advantageouslyranges from about 15 seconds to about 10 minutes, more preferably fromabout 30 seconds to 5 minutes. The pH is not critical to the practice ofthe invention, but typical carbon dispersions and colloids are alkaline.

The desired thickness of the carbon coating is a thickness thatsufficient to allow for a copper or other metal film to be electroplatedonto the printed circuit board in a direct plate process. The upperlimit of the thickness is determined by the ability to remove the carboncoating from the copper surfaces. If the carbon does not come off of thecopper surfaces, then defects in the circuit board can occur, includingpoor copper to copper contact in the innerlayers of the circuit board.This is also referred to as “interconnect defect.” In one embodiment,this thickness may be in the range of about 0.05 to about 0.25 microns.

However, as discussed above what is important is that the thickness issufficient to allow for metal plating in a direct plating processwithout any defects.

In one embodiment, the PWB is contacted with compressed air to unplugany through-holes that may retain plugs of the dispersion.

The carbon black or graphite dispersion on the PWB not only coats thedrilled through hole surfaces, which is desirable, but also entirelycoats the metal (i.e., copper) plate or foil surfaces, which isundesirable. Therefore, prior to subsequent operations, all of thecarbon black or graphite must be removed from the copper (or othermetal) plate and/or foil surfaces.

The removal of the carbon black or graphite, specifically from thecopper (or other metal) surfaces including, especially, the rims of thedrilled holes while leaving the coating intact on the glass fibers andepoxy surfaces of the hole walls is accomplished using a microetch step.

After the microetch step and a subsequent water rinse, the PWB mayeither proceed to a photo-imaging process and later be electroplated orbe directly panel electroplated. The PWB may be further cleaned with,for example, a citric acid or benzotriazole anti-tarnish solution oranother acid cleaner solution, or both, after the above describedmicroetch step. The thus treated printed wiring board is then ready forthe electroplating operation which includes immersing the PWB in asuitable electroplating bath to apply a copper (or other metal) coatingon the through hole walls of the non-conducting layer.

Microetch solutions used to remove excess graphite and/or carbon blackare typically based on oxidizing agents such as hydrogen peroxide or apersulfate, such as sodium persulfate. For example, a sodiumpersulfate-based microetch solution may be combined with sufficientsulfuric acid to make a microetch bath containing 100 to 300 grams ofsodium persulfate per liter of deionized water and about 1 to 10% byweight sulfuric acid.

Any etchant that is suitable for the metal being plated may be used inthe practice of the invention. For example, for copper plating, sodiumpersulfate-based etchants, peroxide sulfuric-acid based etchants, copperchloride-based etchants, ferric-based etchants are all suitable for use.However, any oxidizer that is capable of oxidizing copper metal tocopper ion is sufficient and is usable in the process described herein.

As described herein, the carbon coating is not dried prior to etching.In addition, is also possible to perform the metal plating step as wellwithout first drying the carbon coating. However, it is only necessarythat the carbon coating is not dried prior to the etching step. Thus, inone preferred embodiment, the carbon coating is not dried prior to theetching step. In another preferred embodiment, the carbon coating is notdried before the etching step or the plating step.

After the etching step (or the etching and plating steps), the printedcircuit board is dried for a period of time to remove water. In oneembodiment, the printed circuit board is dried for a period of about 20seconds to about 90 seconds, more preferably about 30 seconds to about60 seconds at an elevated temperature. The elevated temperature may bebetween about 125 and about 200° F., more preferably between about 150and 175° F.

The plated metal is typically copper. However, the present invention isnot limited to copper plated and the plated metal may be any metal thatis capable of being reduced onto the carbon film, including, forexample, nickel, rhodium, platinum, cobalt, gold, tin, lead, and alloysof any of the foregoing. Other metals would also be known to thoseskilled in the and can be plated using the process described herein.

The invention will now be discussed in relation to the followingnon-limiting examples.

EXAMPLE 1

A circuit board containing through holes was processed as follows:

1) The circuit board is immersed into a conditioner (Shadow CleanerConditioner V, available from MacDermid Enthone Inc., Waterbury, Conn.)conditioning bath made up at 10% by volume component A and 10% by volumecomponent B for 30 seconds at 95° F. Component A contains a conditioningagent and Component B contains a surfactant and buffer.

2) The circuit board is rinsed with tap water for 30 seconds.

3) The circuit board is immersed into 40% by volume Shadow ConductiveColloid 5 (available from MacDermid Enthone Inc., Waterbury, Conn.). Thebath contains 40 g/L graphite colloid.

4) The circuit board is spray etched at 20 psi using 80 g/L sodiumpersulfate etch.

5) The board is spray rinsed at 20 psi using tap water.

6) The board is directly electroplated with copper for one hour at 20A/ft² using a bath containing 80 g/L copper sulfate pentahydrate, 200g/L sulfuric acid, 60 ppm chloride ions, and 1% PC606 additive(available from MacDermid Enthone Inc, Waterbury, Conn.).

Upon inspection of the copper plated printed circuit board, there wereno pin holes in the plated copper deposit.

EXAMPLE 2

A printed circuit board containing through-holes was processed asfollows:

1) The circuit board is immersed into a conditioner (Shadow CleanerConditioner V, available from MacDermid Enthone Inc., Waterbury, Conn.)conditioning bath made up at 10% by volume component for 30 seconds at95° F.

2) The printed circuit board is rinsed with tap water for 30 seconds.

3) The printed circuit board is immersed into 40% by volume ShadowConductive Colloid 5 (available from MacDermid Enthone Inc., Waterbury,Conn.). The bath contains 40 g/L graphite colloid.

4) The printed circuit board is spray etched at 20 psi using 80 g/Lsodium persulfate etch.

5) The printed circuit board is spray rinsed at 20 psi using tap water.

6) The printed circuit board is dried with forced air at 150° F. for 30seconds to dry the coating.

7) The printed circuit board is stored for one week.

8) The printed circuit board is electroplated with copper for one hourat 20 A/ft² using a bath containing 80 g/L copper sulfate pentahydrate,200 g/L sulfuric acid, 60 ppm chloride ions, and 1% PC606 additive(available from MacDermid Enthone Inc, Waterbury, Conn.).

Upon inspection of the copper plated printed circuit board, there wereno pin holes in the plated copper deposit.

Examples 1 and 2 demonstrate that the process described herein can beused for direct plating either directly or after storage for a period oftime and still produce the desirable result of a printed circuit boardexhibiting no pin holes or other defects in the plated copper deposit.

Comparative Example 1

Two circuit board coupons containing through-holes were processed asfollows:

1) The circuit board coupons were immersed in a conditioning bath thatwas prepared by mixing 1 g/L of Cyastat SP polymer (a relatively lowmolecular weight polymer having a molecular weight of less than 10,000g/mol, available from Cytec Şolvay Group, Bruxelles, Belgium) and 1 g/Lmonoethanolamine (for pH adjustment).

2) The circuit board coupons are rinsed in deionized water.

3) The circuit board coupons are immersed into a graphite dispersionprepared with 4 wt. % graphite particles and 4 wt. % low molecularweight dispersion surfactant (Zetasperse 3800, available from AirProducts and Chemicals, Inc., Allentown, Pa.).

4) The printed circuit board coupons were split-one was dried after step3) and one was spray etched at 10 psi in 80 g/L sodium persulfate etchbath.

5) The coupons were electroplated in a standard acid copperelectroplating bath (MacDermid PC 606, available from MacDermid EnthoneInc, Waterbury, Conn.).

The coupon that was dried immediately after the graphite dispersion dipplated copper in the through-holes. However, the coupon that was sprayetched did not plate any significant copper in the through-holes becausethe graphite dispersion was washed off the through-hole wall surfaces ofthe circuit board by the spray etch.

Finally, it should also be understood that the following claims areintended to cover all of the generic and specific features of theinvention described herein and all statements of the scope of theinvention that as a matter of language might fall there between.

What is claimed is:
 1. A method of preparing a non-conductive substrateto allow metal plating thereon, the method comprising the steps of: a)conditioning the non-conductive substrate with a conditioning agent,wherein the conditioning agent comprises a conditioner having amolecular weight of at least 1,000,000 g/mol; b) applying a liquidcarbon-based dispersion to the conditioned non-conductive substrate toform a carbon coating on the conditioned non-conductive substrate,wherein the carbon-based dispersion comprises carbon or graphiteparticles dispersed in a liquid solution, wherein the carbon particlescoagulate onto the conditioned non-conductive substrate to form acarbon/conditioner gel coating; and c) etching the substrate.
 2. Themethod according to claim 1, further comprising the step of drying thesubstrate and carbon-based dispersion after step c) to form a conductivecarbon coating on the substrate
 3. The method according to claim 1,further comprising the step of electroplating a conductive metal on thesubstrate after step c).
 4. (canceled)
 5. (canceled)
 6. (canceled) 7.The method according to claim 1, wherein the substrate comprises aprinted circuit board or a printed wiring board.
 8. The method accordingto claim 1, wherein the substrate is contacted with the conditioner byimmersing the substrate in the conditioner for at least about 20seconds.
 9. (canceled)
 10. (canceled)
 11. (canceled)
 12. The methodaccording to claim 1, wherein the carbon-based dispersion comprises oneor more surfactants capable of dispersing the carbon or graphiteparticles.
 13. The method according to claim 1, wherein the averageparticle diameter of the carbon or graphite particles is between about0.05 and about 3.0 microns.
 14. The method according to claim 1, whereinconcentration of the carbon or graphite particles in the carbon-baseddispersion is less than about 15% by weight.
 15. The method according toclaim 3, wherein the substrate is dried for about 20 to about 90 secondsafter one or more of the etching step and the electroplating step. 16.The method according to claim 15, wherein the substrate is dried forabout 30 to about 60 seconds.
 17. (canceled)
 18. The method according toclaim 1, wherein the step of etching the substrate comprises etchingmetal portions of the substrate with an etchant, the etchant beingselected from the group consisting of sodium persulfate-based etchants,peroxide sulfuric-acid based etchants, copper chloride-based etchants,and ferric-based etchants.
 19. A method of conditioning a substrate toaccept a carbon coating thereon, wherein the substrate comprises aprinted wiring board having one or more non-conductive layers, themethod comprising the step of contacting the substrate with aconditioner, wherein the conditioner comprises a conditioning having amolecular weight of at least 1,000,000 g/mol.
 20. The method accordingto claim 19, wherein the step of contacting the substrate with theconditioner comprises immersing the substrate in the conditioner. 21.The method according to claim 19, wherein the conditioner has a pH inthe range of about 7 to about
 14. 22. The method according to claim 19,wherein the conditioner is maintained at a temperature of between about80 and about 130° F.
 23. The method according to claim 19, wherein thecarbon coating is formed by applying a liquid carbon dispersion to theconditioned substrate, wherein the carbon-based dispersion comprisescarbon or graphite particles dispersed in a liquid solution.